Category: Process Subcategory: Plasma Etch, Ashing, Desum, RIE & ICP
Process Type: ASE ICP
Manufacturer: STS Model: ICP ASE Multiplex
Equipment Name: STS s/n 10843 Configuration: up to 8" diameter wafer
Year: Condition: Excellent
Quantity: 1 Availability: Immediate, In Stock
Pricing: Call for Pricing Movie:
Description:
STS Multiplex ASE ICP system, Manual load, single wafer load lock, Standard rate ASE, 150mm wafer configuration, Pfeiffer TMH 100PC turbo pump with TCP 600 controller, RF trolley with ENI ACG3 - 300W RF power supply for lower electrode and ACG10B - 1000W RF power supply for upper electrode, matchworks and tunner for each, remote gas box with (4) MFCs (Ar,O2, SF6, C4F8), 208V
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